Luckim
Next-Gen AI Computing

Unleashing AI
Potential

Deploy the world's most powerful Blackwell and Hopper architecture GPUs. We provide the backbone for enterprise-scale large language models and high-performance computing.

Infrastructure Segments

Comprehensive hardware solutions engineered for reliability and extreme performance.

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Featured Hardware

Immediate availability on high-demand silicon and storage solutions.

NVIDIA H100 SXM
AI Accelerators In Stock

NVIDIA H100 SXM

The world's most advanced data center GPU for AI and HPC workloads.

NVIDIA Blackwell B200
AI Accelerators New Arrival

NVIDIA Blackwell B200

The most powerful GPU ever built, designed for trillion-parameter LLM scaling.

RTX 5090 Series
GPUs Limited Stock

RTX 5090 Series

Ultimate performance for rendering and local AI development workflows.

RTX 5070 Series
GPUs In Stock

RTX 5070 Series

The efficiency leader for professional creative design and 3D modeling.

Enterprise NVMe 15.36TB
Storage New Arrival

Enterprise NVMe 15.36TB

PCIe Gen 5 high-density storage for data-intensive server applications.

Quantum-2 InfiniBand
Networking In Stock

Quantum-2 InfiniBand

Low-latency, high-bandwidth interconnects for massive scale-out GPU clusters.

Engineered for
Reliability.

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Enterprise Validation

Every component undergoes 72-hour stress testing before dispatching to your data center.

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Priority Logistics

Direct global logistics network ensuring hardware delivery within 5-7 business days worldwide.

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Architectural Support

24/7 technical consultation for rack integration and infrastructure optimization.

Server Integration

Latest News

Stay updated with the latest in enterprise hardware and AI development.

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Blackwell Architecture Integration Complete
Product Launches Mar 24, 2024

Blackwell Architecture Integration Complete

Luckim successfully completes integration of Blackwell architecture across all product lines, enabling next-generation AI capabilities.

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Optimizing H100 Performance in Multi-Node Luckim Fabrics
Technical Briefs Mar 22, 2024

Optimizing H100 Performance in Multi-Node Luckim Fabrics

New benchmarks reveal 15% efficiency gains using our proprietary Titan-Link interconnects during large-scale LLM training sessions.

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The Shift to Liquid Cooling: Luckim's 2024 Infrastructure Roadmap
Industry Insights Mar 20, 2024

The Shift to Liquid Cooling: Luckim's 2024 Infrastructure Roadmap

As TDP requirements cross the 700W threshold, Luckim unveils new cold-plate solutions designed specifically for high-density AI clusters.

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Power Your Infrastructure Today.

Contact our hardware experts for custom pricing and enterprise-scale allocation schedules.